Abstract
In this paper, a new quasi-TEM capacitance and inductance analysis of multiconductor multilayer interconnects is successfully demonstrated by using the dielectric Green's function and boundary integral equation approach. Presented is the case with an arbitrary number of dielectric layers and with zero-thickness conductors in the upper most layer. Since the method has been developed for application on microelectronic interconnect structures, we use the Galerkin method for constant charge distribution on the conductors to generate the numerical results. Since the silicon substrate has a substantial effect on the inductance parameter, it is taken into account to determine the transmission line parameters. Studies conducted here show that ignoring the silicon substrate leads to erroneous results in estimating the inductance parameter of the structure. Since the procedure is very efficient as well as accurate, it will be a very useful tool in the practical calculations for high-speed and high-density IC signal integrity verification.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call