Abstract
In this study, the formation and growth of intermetallic compounds (IMC) at Sn/Cu interface were studied by using the molecular dynamics method of modified embedded atom method (MEAM) potential combined with practical experiments. The formation and growth process models of IMC layer at the initial stage of soldering were improved, and the growth trend and mechanism of IMC layer were analyzed. Further analysis of diffusivity shows that the diffusivity changes exponentially during welding and is related to the nucleation and growth of intermetallic compounds. Thus, this study provides valuable insights for the subsequent study on the initial stage of Sn/Cu interface and Sn/Cu solder joint reliability.
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