Abstract

We propose a Monte Carlo (MC) simulation framework for circuits taking into account the time-dependent dielectric breakdown (TDDB) statistics along with time-0 variability and variable negative-bias temperature instability (NBTI) under circuit operating conditions in SPICE environment. MC simulation is performed with the proposed framework for $\sim 100\text{k}$ static random access memory (SRAM) cells using experimentally calibrated device-level degradation distribution. Cell performance degradation is compared for both planar and FinFET-based SRAM cells. It is shown that TDDB can significantly impact the SRAM failure probability even under usual circuit operation. It is reported that FinFET-based cells show far more robustness toward cell performance degradation than their planar counterparts.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.