Abstract

Low-temperature characterization has been performed on fully depleted silicon-on-insulator (FDSOI) field-effect-transistor (FET) with gate length (Lg) down to 25 nm to clarify transport mechanisms that determine device performance in deca-nanometer scale. Linear drain current of FDSOI FET follows Lg−1 scaling down to 25 nm Lg, where mobility dominates, while saturation drain current largely deviates from Lg−1 scaling. Temperature dependence of effective source velocity at high drain voltage (Vds) is weaker than that at low Vds in short Lg and is consistent with that of saturation velocity. Drift velocity measurement revealed velocity overshooting behavior at high lateral field, indicating further Lg scaling benefit.

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