Abstract
Copper thin films were prepared by sono-electrodeposition method at different acid concentrations in the electrolyte. A potential of −450 mV (100 mV negative than the Nernst potential) was selected for the deposition procedure for all the conditions. The thickness of films was found to be in the range of 100–600 nm. Electrochemical analysis was performed by chronoamperometry. Films were characterized by XRD, SEM, AFM, and study of the mechanical properties was done by nanoindentation.
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