On Monolayer ${\rm MoS}_{2}$ Field-Effect Transistors at the Scaling Limit

Abstract

The ultimate scaling limit of double-gate molybdenum disulfide (MoS2) field-effect transistors (FETs) with a monolayer thin body is examined and compared with ultrathin-body Si FETs by self-consistent quantum transport simulation in the presence of phonon scattering. Modeling of phonon scattering, quantum mechanical effects, and self-consistent electrostatics allows us to accurately assess the performance potential of monolayer MoS2 FETs. The results revealed that monolayer MoS2 FETs show 52% smaller drain-induced barrier lowering (DIBL) and 13% smaller subthreshold swing (SS) than 3-nm-thick-body Si FETs at a channel length of 10 nm with the same gating. With a requirement of DIBL , the scaling limit of monolayer MoS2 FETs is assessed to be 8 nm, comparing with 10 nm of the ultrathin-body Si counterparts due to the monolayer thin body and higher effective mass, which reduces direct source-to-drain tunneling. By comparing with the international technology roadmap for semiconductor (ITRS) target for high performance logic devices of 2023; double-gate monolayer MoS2 FETs can fulfill the ITRS requirements.