On direct-current magnetron sputtering at industrial conditions with high ionization fraction of sputtered species

Abstract

In the industry, there is a preference for robust and technologically straightforward solutions that can deliver desired products at reasonable costs. This study introduces a reliable, robust, and cost-effective ion-assisted thin film growth technique called moving focused magnetic field magnetron sputtering. At the core of this technology lies the generation of dense plasma within a small area of the target and the controlled movement of this plasma across the entire target surface. The deposition process, powered by a direct current generator, behaves similarly to high-power impulse magnetron sputtering and yields coatings with properties comparable to those produced by this method. Notably, this study marks the first application of an ion meter to measure the ionized metal flux fraction of sputtered titanium at industrial conditions, revealing values of up to 34% measured at the substrate position.