Abstract
We have investigated ε1−Cu3Ge as an ohmic contact to p-type GaAs, and found that the ε1−Cu3Ge contact has a specific contact resistivity of 5×10−6 Ω cm2 on p-type GaAs with doping concentrations of ∼7×1018 cm−3. The ε1−Cu3Ge contact exhibits a planar and structurally abrupt interface with the GaAs, and no reaction between the contact metal and the GaAs is required for contact formation. The contact is electrically stable during annealing at temperatures up to 400 °C. It is suggested that Ge is incorporated into the GaAs as a p-type impurity resulting in a low contact resistivity. Furthermore, the addition of Ge to Cu to form ε1−Cu3Ge is found to impede the diffusion of Cu into the p-type GaAs. Along with the results reported for n-type GaAs, the present results indicate that ε1−Cu3Ge is an attractive candidate for ohmic contact formation on both n- and p-type GaAs.
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