Abstract
In the present work we consider a numerical solution for laminar, incompressible, and steady oblique stagnation point flow of Cu − water nanofluid over a stretching/shrinking sheet with mass suction S . We make use of the Cattaneo–Christov heat flux model to develop the equation of energy and investigate the qualities of surface heat transfer. The governing flow and energy equations are modified into the ordinary differential equations by similarity method for reasonable change. The subsequent ordinary differential equations are illuminated numerically through the function bvp4c in MATLAB. The impact of different flow parameters for example thermal relaxation parameter, suction parameter, stretching/shrinking parameter, free stream parameter, and nanoparticles volume fraction on the skin friction coefficient, local Nusselt number, and streamlines are contemplated and exposed through graphs. It turns out that the lower branch solution for the skin friction coefficient becomes singular in shrinking area, although the upper branch solution is smooth in both stretching and shrinking domain. For oblique stagnation-point flow the streamlines pattern are not symmetric, and reversed phenomenon are detected close to the shrinking surface. Also, we observed that the free stream parameter changes the direction of the oncoming flow and controls the obliqueness of the flow. The existing work mostly includes heat and mass transfer as a mechanism for improving the heat transfer rate, which is the main objective of the authors.
Highlights
The heat transfer phenomenon in engineering and industrial system is one of the most vital problem in today’s year
Using MATLAB function bvp4c the numerical solutions for the closing system of equations of
The outputs obtained through the bvp4c scheme are displayed graphically for multiple values of different parameters viz. suction parameter S, stretching/shrinking parameter λ, thermal relaxation parameter γ, free stream parameter α, and the nanoparticles volume fraction φ
Summary
The heat transfer phenomenon in engineering and industrial system is one of the most vital problem in today’s year. Such phenomenon arises during the exchange of temperature difference within two medium or physical systems. The Interfacial thermal resistance is the measurement of an interfacial resistance to thermal flow, known as Kapitza resistance or thermal boundary resistance. The Kapitza resistance varies from the contact resistance (not electrical contact resistance), since it presents being at atomically perfect interfaces. The efficient thermal conductivity of Cu is greatly affected due to the interfacial resistance. This field has not been much examined
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.