Abstract
Tape automated bonding (TAB) is a widely used interconnection technology for high-pincount and fine-pitch IC packaging. In this study, a three-dimensional computational model was developed for analyzing TAB inner lead bonding (ILB) process. This experimental study on the thermomechanical properties of copper leads was achieved using high precision micro-force tensile tests. A stress–stain relation between the copper lead and different temperature ranges was successfully implemented into the finite element model to study large plastic deformation in ILB formation. The resulting ILB lead profile and bump sinking values obtained from the simulations agreed well with the experimental observations from actual manufacturing data with the same bonding parameters. The tool position and lead length effects are analyzed to study the residual stress distribution after ILB. A 10-lead model was developed to study how the tool tip profile and planarity ‘angle affect the co-planarity between the bonding tool and the stage. The numerical results show that the permissible tool profile variance should not exceed 1.25 μm and the acceptable planarity angle is 0.005° to achieve the minimum bump deformation requirement.
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