Abstract
In order to improve the performance of thin lm devices, it is necessary to characterize their mechanical, as well as electrical, properties. In this work, a model is developed for analysis of the mechanical and electrical properties and the prediction of residual stresses in thin lms of silver nanoparticles deposited on silicon substrates. The model is based on inter-particle di usion modeling and nite element analysis. Through simulation of the sintering process, it is shown how the geometry, density, and electrical resistance of the thin lm layers are changed by sintering conditions. The model is also used to approximate the values of Young's modulus and the generated residual stresses in the thin lm in the absence and presence of cracks in the lm. The results are validated through comparing them with available experimental data.
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