Abstract
This paper numerically studies the thermal performances of electroosmotic flow (EOF) in a symmetric Y-shaped microchannel heat sink (MCHS) having a constant total channel surface area, that is, constant convective heat transfer area. It is found that the average convective heat transfer coefficient of EOF increases with the increasing driven voltage, which is attributed to the increase of EOF flowrate with the increasing driven voltage. However, the maximum MCHS temperature shows an increasing after decreasing trend with the driven voltage owing to the dramatically increasing Joule heating when the voltage is large enough. Further, both the maximum MCHS temperature and average convective heat transfer coefficient are sensitive to the cross-sectional dimensions of the Y-shaped microchannels. The thermal performances of EOF in the Y-shaped MCHS show a strengthening to weakening trend with the increasing daughter-to-parent channel diameter ratio of the Y-shaped microchannel with circular cross-sectional shape, and show a similar strengthening to weakening trend with the increasing daughter-to-parent channel width ratio and the increasing microchannel height of the Y-shaped microchannel with rectangular cross-sectional shape. These cross-sectional dimension dependences of thermal performances are related to the increasing to decreasing trend of EOF flowrate changing with the microchannel cross-sectional dimensions.
Highlights
The development of miniaturization and integration means microelectronic devices are faced with the challenge of high heat flux, excellent heat dissipation techniques are highly desirable for the cooling of these devices
The channel cross-sectional dimension is an important factor to influence the thermal performances of the microchannel heat sink (MCHS); this present work investigates these effects for the electroosmotic flow (EOF) within
This paper numerically studied the thermal performances including maximum MCHS temperature and average convective heat transfer coefficient of EOF in a Y-shaped MCHS with two channel cross-sectional shapes ofPEER
Summary
The development of miniaturization and integration means microelectronic devices are faced with the challenge of high heat flux, excellent heat dissipation techniques are highly desirable for the cooling of these devices. The effects of channel cross-sectional dimensions of the Y-shaped microchannel on the maximum MCHS temperature and average convective heat transfer coefficient of EOF will be studied, and the possible underlying mechanisms will be investigated. Both circular and rectangular channel cross-sectional shapes are considered. The present study on the thermal performances of EOF in the Y-shaped MCHS will be helpful to design the EOF-based MCHS with optimal fluidic and thermal performances
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