Numerical simulation with LBM of the cooling of electronic component: Effect of the inclination angle

Abstract

As electronic devices become smaller and more powerful they generate a huge amount of heat, effective cooling becomes very challenging and critical. The air-cooled heat sinks attached to heat-generating components must have the appropriate surface area and airflow to dissipate the heat to avoid any failure or conditions caused by reaching the critical component temperature.The main objective of this paper is a numerical study with the LBM of cooling an electronic component present as a heat source in a square cavity with a change of inclination angle of the cavity, while the Rayleigh number is kept fixed on Ra = 106, Numerical investigations are done with different angles of inclination 0°, 30°, 60° and 90°. Results shows that the change of the cavity angle of inclination has an effective effect on the cooling of the electronic component. The choice of LBM as a simulation method is related to the quality and power proved by this method for solving problems of fluid flow calculations at different length scales.