Abstract
We numerically simulated the containerless rapid solidification for micrometer level solder ball used in BGA packaging, based on prior models for heterogeneous droplet nucleation and non-equilibrium solidification, to predict the solidification microstructure of solder ball. Results of simulations for Sn-5mass%Pb solder ball produced under different conditions are discussed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
