Abstract
The effects of 125°C holding time on static strength of package solder ball and impact strength of package solder ball have been investigated for BGA-IC package with Pb-free solder or Pb solder. A solder ball failure can be divided into ductile failure of solder ball and interface failure between a copper and intermetallic compound. Results shows that aging time increases the ductile strength of solder ball in a package and decrease the interface strength of package. The impact strength of solder ball in a BGA package can be predicted from the static strength of solder ball. The predicted impact strength of solder ball was compared with the actual impact strength of solder ball. It shows good correlation.
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