Abstract
This work used a porous approach model to numerically investigate the fluid flow and heat transfer characteristics of the pin-fin heat-sink array in a rectangular channel with in-line arrangement. The air flow through the channel was laminar. The pin-fin heat sinks with various porosities and pin-fin numbers were employed. The relative center-to-center longitudinal and transverse distances between adjacent heat sinks were changed. The results indicate that the Nusselt number of various heat-sink arrays increased with decreasing the relative center-to-center transverse distance, but not varied with the relative center-to-center longitudinal distance. For the typical pin-fin heat-sink arrays, the Nusselt number changed slightly for the heat sinks with 0.358–0.556 porosity, but increased by 11.7%–24.8% when the porosity increased from 0.556 to 0.750, and then dropped obviously when the porosity exceeded 0.750. Increasing the number of pin fins continuously could increase Nusselt number. However, when the number of pin fins was large, the Nusselt number increased with the number of pin fins slowly. The present numerical simulation has been validated by the typical experiment. Finally, a semi-empirical correlation of Nusselt number for each heat sink in the heat-sink array was proposed.
Highlights
Since the invention of integrated circuit (IC) in 1964, the speed of computers has rapidly increased.As one IC can hold tens of electronic modules, the function of an electronic module is equivalent to a transistor or vacuum tube, so that the computer becomes smaller and more powerful
They showed that the inline square pin-fin heat sink has topological advantage over the plate-fin heat sink, the heat spreading through the plate-fins on reducing the peak temperature on the substrate is pronounced
It generally agrees to the numerical simulation
Summary
Since the invention of integrated circuit (IC) in 1964, the speed of computers has rapidly increased. This work is to discuss putting the pin-fin heat-sink array into a rectangular channel in in-line arrangement with laminar side-bypass effect This configuration is similar to the PCB substrate of LSI array with heat sinks inside the general supercomputer. Jeng [18] used porous approach model to simulate the fluid flow and heat transfer characteristics of single square pin-fin heat sink with laminar side-bypass effect. The forced convection is considered by employing the non-Darcy model for fluid flow and the thermal non-equilibrium model for heat transfer They showed that the inline square pin-fin heat sink has topological advantage over the plate-fin heat sink, the heat spreading through the plate-fins on reducing the peak temperature on the substrate is pronounced. The effects of various parameters, such as the porosity of heat sink, the number of pin fins and the relative longitudinal and transverse distances between heat sinks, on the fluid flow and heat transfer were analyzed
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