Abstract
The reliability of printed circuit board level is investigated through the optimisation of layout, power and heat dissipating. Different models of AMD HD5550 circuit module are built with different parameters combination based on computational fluid dynamics (CFD) theory. The thermal structures of these models are simulated by FLOTHERM. The result shows that thermal layout has a significant effect on the thermal reliability of the modules. The thickness of heat sink substrate also affects the temperature distribution of the board. The method and result supply a theoretical reference value for thermal design of the printed circuit board level.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: International Journal of Materials and Structural Integrity
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
