Numerical investigation on the characteristics of flow and heat transfer enhancement by micro pin-fin array heat sink with fin-shaped strips

Abstract

Targeted at improving microfluidic cooling for the use of micro heat sink in electronic chips, a novel fin-shaped pin-fin array heat sink is proposed. In this study, the mechanism of flow and heat transfer, the arrangements of pin-fin layout, the characteristics of single-phase flow and heat transfer among the micro cylinder pin-fin heat sink, micro fin-shaped pin-fin heat sink of A、B、C types are investigated. It’s showed that stagger micro fin-shaped A pin-fin (SMFAP) exhibits the best hydro-thermal performance. At high Reynolds number, the average Nusselt number of SMFAP reaches up to two times of the in-line micro cylinder pin-fin (IMCP). Moreover, the structure of fin-shaped pin-fin can enhance heat transfer by increasing Nu, while weaken heat transfer by large pressure drop. Therefore, the non-dimensional parameter PEC is adopted to evaluate the heat transfer performance of heat sink. When Re is 800, the PEC of SMFAP reaches to its maximum value of 1.4. SMFAP can effectively enhance heat transfer, while stagger micro fin-shaped B pin-fin(SMFBP) and stagger micro fin-shaped C pin-fin (SMFCP) are not obviously. It’s concluded that different structures of fin-shaped pin-fin will affect the separation point of flow, thus affecting the size of vortex behind the cylinder.