Abstract
Cooling on electronic objects, especially laptop is something to note. If the cooling system is not good, there will be overheating on the main chip motherboard and other components so that the laptop will be damaged quickly. This research aims to determine the temperature distribution on the heat sink laptop so that overheat can be overcome. This research was carried out numerically, where the specimen was a heat sink component on a laptop unit simulated using Solid works 2011 software in three dimensions with variations carried out in the form of air velocity values passing through the specimens of 5, 10, and 15 m/s. The results obtained in this study showed that the higher the speed of air flow through the heat sink, the higher the transfer of heat transfer.
Highlights
Improved capabilities in today's modern computer technology cause the electronics components to become hotter faster
Based on the analysis that has been done about the effect of air velocity variation on cooling on the heat sink, it can be concluded: 1. From the temperature contour, it is seen that the heating temperature accumulates at the rear of the heat sink for the upper case, and the heat transfer time occurring on the heat sink surface is 00:05, 00:07, 00:09 s for 5, 10, 15 m/s
While the temperature contour of the front heatsink looks that the heating temperature covers the entire area of the heat sink, the heat transfer time that occurs at each speed is 00:01, 00:03, 00:05 seconds with variations in the air velocity provided by the heat sink can speed up the cooling process
Summary
Improved capabilities in today's modern computer technology cause the electronics components to become hotter faster. This problem can degrade the performance of the component. The need for an effective cooling tool to reduce the heat on the component becomes higher. Cooling using a heat sink is one solution that is quite interesting. Heat sinks are cooling devices commonly used today. Given the importance of the role of heat sink, its performance needs to be analyzed. Et al (2016) performed numerical analysis to determine the effect of splitters on the hydrothermal behavior of pin fins. The results showed that splitter use improved the hydrothermal performance of both pins
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