Abstract
The localized electrodeposition process (LED) is a non-thermal additive manufacturing process that uses the combination of the electrochemical deposition principle and additive manufacturing. It is capable of producing complex 3D parts directly from the CAD model. The deposition is localized by the use of a micro tool of a diameter much smaller than the substrate. This process can produce sub-micrometer features size components using materials including metal, alloys, and polymers. In this study numerical modeling was performed to study the effect of applied voltage, and interelectrode gap on the deposition rate for the nickel-based electrolyte. The microelectrochemical additive manufacturing process was analyzed through a numerical study using COMSOL® Multiphysics software. The simulation incorporated boundary conditions aligned with the process parameters for localized electrodeposition. Notably, the simulation results demonstrated strong agreement with the experimental output obtained from the developed LED setup.
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