Abstract
A study has been made to determine the effect of an electrochemically produced titanium-oxide film on the nucleation of copper. The oxide films were made galvanostatically at 25°C in 1 M sulphuric acid on pure titanium metal. Potentiodynamic, potential step and current step experiments were performed in an additive-free copper sulphate-sulphuric acid electrolyte at 25°C. It was found that the oxide film played an important role during nucleation. By increasing the thickness of the anodic film it was possible to decrease the diameter and to increase the surface density of copper nuclei. The kinetics of nucleation and growth of the copper deposits were analysed. The deposits were examined by SEM.
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