Kinetics of underpotential deposition and nucleation of copper on the Pt(111) face in the presence of acetonitrile

Abstract

The kinetics of underpotential deposition, three-dimensional nucleation, and growth of copper deposits at cathodic overpotentials on a Pt(111) electrode in solutions containing 0.5 M H2SO4, 10 mM CuSO4, and 0–200 mM acetonitrile (AcN) is studied by the cyclic voltammetry, potentiostatic current transients, and scanning probe microscopy methods. At low volume concentrations of acetonitrile ([AcN] ≤ 4 mM), adsorbed acetonitrile molecules accelerate the formation of a co-adsorption lattice of copper adatoms with anions due to local electrostatic effects at the charged interface. At higher concentrations, the underpotential deposition process is hampered, but the desorption of copper adatoms occurs at potentials more positive than those at low acetonitrile concentrations. This effect is attributed to a stabilizing action of acetonitrile molecules situated on the layer of copper adatoms and, in part, on platinum. At [AcN] = 0.4–40 mM, adsorbed acetonitrile molecules accelerate the growth of the bulk copper deposit, but the nucleation stage is hindered. The dependence of the copper amount on the deposition potential at [AcN] = 40 mM exhibits a maximum at 0.15–0.17 V. This effect was previously observed in weakly acid solutions (pH 1.7–3.0) containing no acetonitrile. The maximum rate of the deposit growth corresponds to an optimum number of crystallites (which is not too great) and an optimum distance between the growing centers in conditions of mixed kinetics “diffusion + electron transfer.” A substantial number of complexes Cu(I)-AcN forms at high acetonitrile concentrations.