Nozzleless Acoustic Droplet Ejector With Electrically Tunable Droplet Size for Picking and Placing Semiconductor Chips

Abstract

This paper presents a microfabricated nozzleless acoustic droplet ejector with electrically tunable droplet size as a new tool for on-demand picking and placing semiconductor chips for semiconductor packaging. The ejector is based on a 2-mm-thick lead zirconate titanate (PZT) sheet with a planar annular-ring air-cavity acoustic Fresnel lens on top. When driven with sinusoidal pulsed voltage signals of 1.16 MHz, the ejector generates focused ultrasound with 1-mm focal diameter and 5-mm focal depth at 22 mm focal length in sodium polytungstate (SPT) solution. A finite-element-method (FEM) simulation model calculating the acoustic-field-induced fluid motion during the droplet ejection process has been developed, and verified by experiments, in which the device ejects SPT droplets whose diameter is from 850 to 2, 490 μm, controlled by the driving pulse width and voltage. The ejected droplets are able to carry 400- μm-thick square silicon chips with side length from 700 to 3, 100 μm. A polyester channel-embedded guiding cover for semi-automatic loading of silicon chips to the ejection site is designed to avoid manual placement of the silicon chips. With the proof-of-concept system, we demonstrate ejecting silicon chips out of SPT surface onto a nearby paper, assembling them into arrays with good repeatability. [2020-0337].