Novel hydrometallurgical process for the recovery of copper from end-of-life mobile phone printed circuit boards using ionic liquids

Abstract

Printed circuit boards, which are embedded in mobile phones, are complex composite materials containing valuable components of strategic and critical importance. With the number of mobile phone devices operating worldwide expected to reach 18bn by 2025, their low recycling rate leads to high tonnages of waste printed circuit boards (WPCBs) at their end of life. Copper, representing 58% of the total metal content in an end-of-life mobile phone (EoL-MP) and the main metal present in the printed circuit board, with an average of 27.8 wt %, offers a resource-rich source of this strategic metal for recovery. To overcome the limitations associated with conventional technologies for recycling WPCBs, use of greener technologies (ionic liquids (ILs) as leaching agents), offers greater potential for the recovery of copper from this waste stream. Presented here for the first time is an optimised hydrometallurgical process for recovery of copper involving pre-treatment, leaching, and electrowinning and the use of two task-specific ionic liquids. The pre-treatment step, using the IL [Bmim]BF4 proved to be a clean, efficient, and non-polluting system for the separation of solder and electronic components (ECs) from WPCBs, at 210 °C, 150 rpm for 15 min, favouring the enrichment of copper for a subsequent recovery process. The IL, [Bmim]HSO4, successfully leaches >99% of copper from pretreated WPCBs under the optimal conditions of 30 %v/v [Bmim]HSO4, 10 %v/v H2O2, and 60 %v/v H2O at 60 °C, 1:15 solid to liquid ratio for 2 h. Recovery of copper is achieved through direct electrowinning from the [Bmim]HSO4-leach solution, as electrolyte. Under controlled deposition conditions of 100 mA (4.2 V) during 2 h, 100% of copper (>99% purity) is recovered with an average current efficiency of 78% and an energy consumption of 4.5 kWh/kg Cu. This work combines a dual leaching and electrowinning system that is clean, environmentally friendly, minimises reagent use and spent wastes, permits multiple reuses of both the ILs, and maximises resource conservation through recovery of copper metal and return of secondary streams (electronic components and solder) for reuse in new or refurbished components or products.