Abstract
We propose a novel hybrid bonding technology with a high stacking yield using ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration. To solve the critical issues of a current standard hybrid bonding technology, we developed scaled electrodes with slightly extruded structure and unique adhesive layer of anisotropic conductive film composed of ultra-high density CNP. Test element group (TEG) dies with 7-mm $\times 23$ -mm size are bonded to interposer wafer by a new hybrid bonding technology. Scaled electrodes with 3- $\mu \text{m}$ diameter and 6- $\mu \text{m}$ pitch are formed in each TEG chip. We confirmed for the first time that a huge number of electrodes of 4 309 200 are successfully connected in series with the joining yield of 100% due to the ultra-high density CNP.
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