Abstract
AbstractA novel high temperature thermosetting resin system based on the addition polymerization of bis (4‐maleimidophenyl)methane and o, o′‐diallyl‐bisphenol A is presented in this paper. This system offers the combination of easy solventless processing and the high temperature and toughness performance characteristics demanded for the fabrication of C‐fibre laminates. The mechanism of the polyaddition reaction is unusual. In a first step an ENE addition reaction of the maleimide to the allyl group occurs to give a 1:1 adduct with a propenyl phenol type of structure. This is then followed by a Diels‐Alder addition reaction of another maleimide functional group to the ENE adduct (by the so‐called Wagner‐Jauregg reaction) to give a densely crosslinked polymer with glass transition temperatures well over 280°C.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
