Novel high dielectric constant nano-structure polymer-ceramic composite for embedded capacitor application

Abstract

Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Developing a suitable material that satisfies electrical, reliability and processing requirements is one of the major challenges of incorporating capacitors into a print wire board (PWB). Polymer-ceramic composites have been of great interest as embedded capacitor material because they combine the processability of polymers with the desired electrical properties of ceramics. A novel nano-structure polymer-ceramic composite with very high dielectric constant (/spl epsi//sub r/-100, a new record for the highest reported /spl epsi//sub r/ value of nano-composite) has been developed in this work. High dielectric constant is obtained by increasing the dielectric constant of the epoxy matrix (/spl epsi//sub r/>6) and using the combination of PMN-PT/BaTiO/sub 3/ as ceramic filler. This nano-composite has low curing temperature (<200/spl deg/C), thus it is MCM-L (multi-chip-module laminate) process compatible. An embedded capacitor prototype with capacitance density of 25 nF/cm/sup 2/ has been manufactured using this nano-composite and spinning coating technology. The effect of composite microstructure on the effective dielectric constant has been studied. This novel nanocomposite can be used for the integral capacitors as an important component of SOP (system on packaging) technology that is proposed by packaging research center of Georgia Tech.