Abstract
Integral passive components can reduce assembly cost and improve electrical performance as compared with traditional discrete passive components. Developing a suitable material that satisfies electrical, reliability, and processing requirements is one of the major challenges of incorporating passives into a print wire board (PWB). Polymer-ceramic composites have been of as much interest as integral capacitor materials because they combine the processability of polymers with the desired electrical properties of ceramics. In this work a polymer-ceramic composite with very high dielectric constant (/spl epsi//sub r/=89) has been developed for embedded capacitor application. High dielectric constant material is obtained by increasing the dielectric constant of the epoxy matrix (/spl epsi//sub r//spl sim/5) and using the combination of PMN-PT/BaTiO/sub 3/ as ceramic fillers. The effect of the composite microstructure on the effective dielectric constant has been studied.
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