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https://doi.org/10.1039/d1tc06122d
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Cite Journal: Journal of Materials Chemistry C |  Publication Date: Jan 1, 2022 |
 Citations: 52 |
Affiliation: University of Toronto
Due to their high service temperature, excellent thermal insulation, and nanoporous morphology, polyimide (PI) aerogels have the potential capability to be used in the next generation of microelectronic devices and flexible electronics.
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