Abstract
With the aid of the thermal model, thermal resistance matrix of emitter-segmented power HBT is proposed to represent thermal effects. The effect of 2-dimensional (2-D) inter-segment spacing on thermal stability of device is studied. It is shown that the increase of inter-segment spacing could effectively decrease thermal coupling resistance, lower temperature of center segments, and hence improves the thermal stability. Furthermore, a novel emitter-segmented power HBT with 2-D non-uniform segment spacing is proposed, in which the non-uniformity of segment temperature is improved by 75.26% and the maximum power level difference of emitter segment is improved by 55.84%, when compared with uniform segment spacing HBT. Therefore the technique of 2-D non-uniform segment spacing is a better method for enhancing the thermal stability of power HBTs.
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