Abstract
The SiP enables an easy integration of different types of chip and can be manufactured with few technical innovations. Wafer thinning technologies are key to achieve the SiP. BSG and dicing processes are mechanical processes using diamond grits. These mechanical processes have a high productivity and a low cost as its merits; however, these processes damage such chip surfaces. We already proposed a novel wafer thinning process namely a dicing before grinding (DBG) and DBG + mirror finish process. After DBG process, Die Attach Film (DAF) is diced using a laser dicer. This process is low productivity and high cost. In this study, a novel DAF separation process; spraying a high-pressure air to the DAF has been developed. This novel process achieves high productivity and low cost. We arrived at best process condition to separate the DAF.
Published Version
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