Notice of Violation of IEEE Publication Principles: Design and simulation of MEMS based piezoresistive pressure sensor for enhanced sensitivity

Abstract

Notice of Violation of IEEE Publication Principles<br><br>"Design and Simulation of MEMS Based Piezoresistive Pressure Sensor for Enhanced Sensitivity"<br> by Avishek Ghosh, Sunipa Roy, C.K. Sarkar in the International Conference on Energy Efficient Technologies for Sustainability (ICEETS), April 2013<br><br> After careful and considered review of the content and authorship of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE's Publication Principles.<br><br> This paper contains text and figures from the paper cited below. The original content was copied without attribution (including appropriate references to the original author(s) and/or paper title) and without permission.<br><br> "Design, Fabrication and Performance Simulation for MEMS Based Piezo-Resistive Pressure Transducers with Sensitivity and Temperature Dependency"<br> Madhurima Chattopadhyay, Swapan Das, Mita Dutta Sensors & Transducers, Vol 86, Issue 12, December 2007, pp. 1823-1831<br><br> <br/> The application of MEMS to the measurement of pressure is a mature application of micromachined silicon mechanical sensors. The present paper describes the design and simulation of surface micromachined piezo resistive type pressure sensor for enhanced sensitivity. The principle of the sensing mechanism is based on the deflection of sensing silicon nitride diaphragm. In order to achieve better sensor performance, a FEM analysis using mechanical analysis module of Intellisuite software is performed to evaluate the system output sensitivity of the pressure sensor. The deflections of the diaphragms (for square as well as circular) have been studied for different applied pressure. From this, the operating range as well as the sensitivity of the sensors can be easily determined. A detailed analysis of the deflection with different applied pressure is presented graphically. The output voltage and material elasticity of diaphragm are affected by temperature variations. So, use of heat sink is required for temperature compensation purpose. This simulation results depict that proper selection of the diaphragm geometry and piezoresistor location can enhance the sensor sensitivity with lower power consumption.