Abstract
Interest in thin-film nanostructures as building blocks for nanoelectronics and nanoelectromechanical systems (NEMS) is increasing. Resistance spot welding (RSW) on a nano or micro scale can play a significant role; similar to that of its macro counterpart for forming connections in device assembly processes. This Note presents a novel micron scale RSW technique using a microgripper as mobile spot welding electrodes to assemble ultra-thin film nanostructures. As an example, assembly of three-dimensional helical nanobelt (HNB) based device was successfully demonstrated using the proposed system. The spot-welding process was fully monitored by the built-in capacitive micro force sensor of the microgripper. Experiments show that RSW, using the microgripper, provides a stable electrical contact with sufficient mechanical strength for the construction of devices such as HNB based devices demonstrated here.
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