Note: Improvement of the 3ω thermal conductivity measurement technique for its application at the nanoscale.

Abstract

Conventional techniques for thermal conductivity measurements can lead to unreliable results when applied to nanostructures because heaters and temperature sensors needed for the measurement cannot have a negligible size and therefore perturb the result. In this paper, we focus on the 3ω technique, applied to the evaluation of the thermal conductivity of suspended silicon nanoribbons. We introduce a numerical approach based on the finite element solution of the electrical and thermal transport equations and compare its results with those of conventional methods. We show that with our approach we achieve an excellent fit of the experimental data, in particular, for nanostructured materials.