Abstract
The implementation of the Smart City system needs reliable and smoothly operating electronic equipment. The study is aimed at developing a nondestructive testing method for electronic equipment and its components. This method can be used to identify critical design defects of printed circuit boards (PCB) and to predict their service life, taking into account the nature of probable operating loads. The study uses an acoustic emission method to identify and localize critical design defects of printed circuit boards. Geometric dimensions of detected critical defects can be determined by the X-ray tomography method. Based on the results of the study, a method combining acoustic emission and X-ray tomography was developed for nondestructive testing of printed circuit boards. The stress-strain state of solder joints containing detected defects was analyzed. This paper gives an example of using the developed method for estimating the degree of damage to joints between PCB components and predicting the service life of the entire PCB.
Highlights
IntroductionThe key resources for implementing the Smart City strategy are information and intelligent processing systems designed to ensure a stable link between individuals and knowledge
The Smart City is the latest development in the field of urban planning
The analysis of the existing nondestructive testing methods demonstrates that the acoustic emission (AE) method can be adapted to identify growing design defects of printed circuit boards
Summary
The key resources for implementing the Smart City strategy are information and intelligent processing systems designed to ensure a stable link between individuals and knowledge. The X-ray method allows us to test a PCB with a resolution of 0.5 μm, to identify all discontinuities in its design, and to create a detailed 3D model of the test object This analysis requires significant time and additional risk assessment of identified defects. With these methods, it is difficult to identify latent defects that will be growing in size during the operation of a device with PCB. The analysis of the existing nondestructive testing methods demonstrates that the acoustic emission (AE) method can be adapted to identify growing design defects of printed circuit boards. This study is the first to use such an integrated nondestructive testing approach to printed circuit boards
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