Non-conventional approach in single-sided lapping process: kinematic analysis and parameters optimization

Abstract

The lapping process is strongly affected by a number of input parameters. One of the fundamental mechanical processes in lapping is the abrasive effect of particles. In order to examine the influence of the kinematic parameters on the lapping uniformity of unconventional single-sided machine, numerical simulations of particles sliding trajectories are performed. Changing the kinematic parameters, e.g., rotational velocities or position of the conditioning rings together with the workpieces can be used for correcting the profile of an active surface of the lap. This paper provides a basic guide to the kinematic parameter settings of single-sided lapping process. Furthermore, an unconventional single-sided lapping system, where a conditioning ring performs additional motion during the machining, is described. Simulation results show that the rotational speed ratio of the conditioning ring to the lapping plate k1 and the period ratio of the reciprocating motion to the lapping plate rotary motion k2 represent the relationships among the three basic motions of unconventional lapping systems and are major factors affecting trajectory distribution. Material removal rate and trajectory density parameter are proposed to optimize the kinematic parameters for better uniformity of lapping plate wear. The preferred kinematic parameter values for single-sided lapping system with reciprocating motions and the assumed size of the machine are k1 = 0, 78 and k2 = 2. The general results were validated on a specially designed test stand.