Abstract
Based on the theoretical study in our previous work, a novel thermal assisted ultrasonic bonding method for polymer Micro/nanoElectro-Mechanical Systems (M/NEMS) has been demonstrated. Bonding experiments of PMMA microfluidic chips with micro-channel of 80 μm in depth and width were conducted. The result shows numerous superiorities of this method including high bonding strength (0.95 MPa), low dimension loss (0.8% in depth and 0.3% in width, respectively) and short bonding duration.
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