Abstract
Substrate coupling noise effects in wireless receiver systems in terms of the crosstalk power spectral density induced from the fast switching digital circuits is the center of study in this paper. Deterioration in performance of a low noise amplifier is plotted against various values of die-attach inductance, inductance on digital ground pins, physical separation between the analog and digital circuits on-chip, number of simultaneous switching output buffers, etc. Different Ball Grid Array Packages, both the wire bonded and flip-chip attached versions have been studied. The return loss and insertion loss for paths from the on-chip wire bond pad to connect pads on the printed circuit boards have been plotted. Results show that noise reduces by a greater amount for reduction in die-attach inductance as compared to a reduction in inductance on the digital ground pin.
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