Power integrity co-analysis and design in a PCB with BGA package using transmission matrix method

Abstract

Power integrity (PI) is among the main concerns in the design process of multilayer packages and printed circuit boards (PCBs). Based on Transmission Matrix Method (TMM), the PI performance of a Ball grid array (BGA) package mounted on a PCB is investigated in this paper. The power/ground planes and the power/ground balls on a PCB and package are entirely equivalent to distributed RLGC circuits model and co-analyzed. From this model, power performance could be computed with high efficiency. Moreover, a design rule of power/ground balls arrangement is obtained by reducing the equivalent inductance and equivalent capacitance of BGA for good power integrity performance.