Abstract
The semiconductor packaging industry is undergoing a step-change transition from gold to copper wire bonding brought on by a quadrupling of gold cost over the last 8 years. The transition has been exceptionally rapid over the last 3 years and virtually all companies in the industry now have significant copper wire bonding production. Among the challenges to copper wire bonding is the damage to bond pads that had been engineered for wire bonding with the softer gold wire. This paper presents an extensive evaluation of electroless NiPd and NiPdAu bond pads that offer a much more robust alternative to the standard Al pad finish. These NiPd(Au) bond are shown to outperform Al in virtually all respects: bond strength, bond parameter window, lack of pad damage and reliability.
Published Version
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