Abstract
In this digital-age era, solder plays important role in electronic packaging industries. As interconnects material, solder provide an electrical and mechanical support to the electronics devices. Solder usually consist of two or more addition of microalloying. By microalloying addition, the solidification structure can be modified. This paper reviews the addition of Ni as microalloying in Sn-Cu lead free solder. Small additions of Ni resulted with an improvement of solder in microstructure and in intermetallic compounds. The stabilization of hexagonal structure of Cu6Sn5 in lead-free solder alloys occurred due to present of Ni.
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