Abstract
Possibility of the deep etching using plasma reactive ion etching (RIE) without an etching-mask (mask-less) for -Z and +Z parts formed on the same surface by partially polarization reversing LiNbO3 single crystal polarized in the direction of c-axis is investigated. NF3/H2 mixture gas was used. The etching rates, depths and the profiles of etched surfaces were evaluated by atomic force microscopy (AFM) and optical microscope. The etching rate for -Z surface was larger than that for +Z surface. The extension of +Z domain by the partially polarization-reversing was observed. Applying the high voltage quickly for the partially polarization-reversing, the area of +Z domain was extended compared with applying voltage slowly. Apparent step at the boundary between -Z and +Z parts formed on the same surface was observed. Using NF3/H2 mixture gas, segments are removed efficiently. It is concluded that RIE etching using NF3/H2 mixture gas is suitable for processing of LiNbO3 crystal surface without a etching-mask compared with CF4/H2 mixture gas.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
