Abstract
In this study, a novel fabrication method of nanostructure by reactive ion etching (RIE) process on PDMS without predefinition of nanopattern is proposed. During etching process, self-formed high-aspect-ratio nanostructure was observed on PDMS surface adjacent to SiO2 area, suggested the provision of nano masks from the SiO2 residue during RIE etching. In tuning the flow rate of working gases (CF4, O2), the distribution of nanostructure can be controlled. Furthermore, it was observed that different species of nanostructures could be fabricated by the selection of mask materials (SiO2, Cu) under RIE etching.
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