Abstract
A heat-resistant photosensitive polymer consisting of furan-substituted polyimide (FPI), and fullerene C60 as a photosensitizer has been developed. The FPI was cross-linked by a photo-oxidation-induced polycondensation (POP) reaction by means of the intervention of singlet oxygen generated from C60 triplet state photosensitization of oxygen molecules. Photochemical study using the laser flash photolysis method revealed that the C60 triplet state was quenched by FPI in solution. This phenomenon suggested a possibility that the POP reaction was hindered. However, in polyimide film, the effect of FPI on the quenching of the C60 triplet state was negligible. This is due to a fast diffusion rate of oxygen in polyimide film in comparison with the mobility of the FPI. It was shown by photolithographic evaluation that postexposure baking (PEB) enhanced the curing rate of the POP polyimide. Photolithography with PEB treatment at 120°C for 10 min is capable of boring pinholes of 10 µm diameter in a 12-µm-thick POP polyimide film. The thermostability of POP polyimide was found to be quite high, with the temperature needed to induce a 5% weight loss being higher than 370°C even without high-temperature annealing.
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