Abstract
Photo-oxidation induced polycondensation (POP) resin consisting of furan-substituted polyimide and fullerene C 60 has been applied to the heat-resistant photosensitive polymer. The properties of the POP polyimide in terms of curing behavior and thermostability were studied. The results showed that the photosensitivity of the POP polyimide depended on the post-exposure baking (PEB) which enhanced the curing rate of it. It showed excellent thermostability; the 5 % weight loss temperature of it reached higher than 370 °C even without high temperature annealing.
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