Abstract
Herein, we report on a newly developed and commercialized organic photo-curable Nanoimprint Lithography (NIL) resist, namely mr-NIL210. Since this new NIL resist follows an innovative design concept and contains solely specific monomers with a characteristic chemistry and molecular design, an extended longevity of applied polydimethyl siloxane (PDMS) stamps is enabled addressing a crucial key metric for industrial high-volume manufacturing processes. Moreover, the mr-NIL210 is characterized by a negligible oxygen sensitivity of the curing chemistry, outstanding film forming and adhesion performances as well as excellent plasma-based dry etch characteristics for various substrate materials like silicon, aluminum, sapphire, titanium, etc.
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