Abstract
Novel LCP films have been developed by iQLP, LLC in a Joint Development effort with Dupont, for commercialization in the Printed Circuit Board (PCB) industry, for high frequency applications. The films will be commercialized as Copper Clad Laminate (CCL), and thermoplastic bond ply. Prototype PCB's have been built to evaluate integrity during processing, and tested for mechanical reliability. The films/laminates were well suited for PCB manufacture, and the resulting board's surpassed reliability testing requirements. Of particular note, is the low Z axis coefficient of expansion of the LCP which allows for multilayer reliability and the large difference in melting temperature between the bond and circuit layer which allows for ease of manufacture. In addition RF test vehicles were established that demonstrated that the material supports very low loss signal transmission in Millimeter wave frequencies in the range 40 to 110 GHz, making this material system one of the best circuit laminates available for Millimeter wave applications today.
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