Abstract
The physical and technological aspects of wire ball-wedge bonding in the assembly of integrated circuits are considered. The video camera and the pattern recognition system (PRS) of new bonder helps to provide accurate positioning of the bonding tool on the chip pads of integrated circuits. The formation of the loop wire cycle is ensured by the synchronous movement of the bonding head along the Z axis and the working table along the XY axes based on the servo drive. A feature of the bonder is that it can bond all the wire loops of the electronic device according to the pre-recorded program without needing to align the bonding points.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
