Abstract
New functional epoxy resins were prepared by the reaction of dialyldiglycicylbisphenol A (DADGBPA) with diaminodiphenylmethane. DADGBPA was prepared by reaction of o,o′-diallylbisphenol A with epichlorhydrine. By reaction of functional epoxy resins with bismaleimides, new epoxy-bismaleimide resins with good thermostability were obtained. The thermal properties of epoxy resins and epoxy-bismaleimide resins were determined by DSC and TGA measurements.
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