Abstract
Abstract— Novel process architectures are proposed for fabricating large‐area high‐resolution TFT‐LCDs with a minimal number of process steps. A low contact resistance between Al bus lines and the transparent conductive oxide layer, necessary for large‐area panels, is obtained by inducing a self‐formed inter‐metallic compound layer at the interface without using any additional buffer or capping layers. For enhanced brightness and resolution, a new TFT array structure integrated on a color‐filter substrate, referred to as an Array on Color Filter (AOC) structure, has been developed. Good‐quality TFTs were successfully constructed on the newly developed color filter for AOC within a sufficiently wide process margin. By adopting these novel technologies, a 15.0‐in. XGA prototype panel was fabricated and shows good display performance. Thus, these novel technologies have improved cost efficiency and productivity for TFT‐LCD manufacturing, and can be applied to the development of TFT‐LCDs of extended display area and enhanced resolution, benefiting from the low resistance bus lines, the high aperture ratio, and reduction in total process steps.
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